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Job Description
At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We're committed to fostering an environment for every teammate that's welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
Boeing's Solid State Electronics Development organization (SSED), within the Boeing Research and Technology (BR&T) organization, performs microelectronics technology development and design for aerospace systems.
We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conduct research and designs microelectronics hardware in support of these projects.
We are seeking physicists and engineers to perform microelectronics test, verification, and characterization/analysis of custom digital, analog/mixed-signal, and RF SoCs die and packaged devices.
This position has a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week.
Position Responsibilities: