Vacancy expired!
RESPONSIBILITIES:
Kforce's client, a small to medium size Semiconductor company in Chandler, AZ is seeking a Senior Product Manager for our Flip Chip Packaging Assembly product line. We are working directly with the Hiring Manager on this exclusive search assignment. The company offers a competitive compensation package including base salary, annual bonus, etc. This position includes product management and direct customer interactions for new product development, qualification, and mass production of advanced flip chip products. This position does not have any direct reports.
Responsibilities:
Daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development/NPI programs
Driving customer requirements and timelines to multiple SEA factories
Deep diving into root cause failure analysis and clearing obstacles with product design, reliability, and manufacturability issues
Performing and analyzing detailed cost modeling for providing product level assembly pricing
This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill
Work closely with suppliers to identify capabilities and capacities for all key processes and material sets (ABF, uBall, stacked vias, Coreless, etc.)
Responsibility for substrate technology path finding and roadmap execution
Direct interface with suppliers and factory engineers for new substrate development and qualification
Drive substrate suppliers to meet technology requirements and timelines
Align on Technology Roadmaps and drive flip chip priorities
Assist/lead to resolve substrate quality issues at suppliers and factories
REQUIREMENTS:
BS/MS degree in Mechanical, Chemical, Materials, Electrical engineering or other related
10+ years of experience in the semiconductor industry
Technical Project Management experience (preferably, involving offshore factories) and the ability to collaborate across numerous programs and teams
Ability to work independently
Ability to overcome obstacles and assume ownership of program success
Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors
Excellent written and verbal communication skills
Frequent face to face and teleconference technical presentations to customers is required
Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
Preferred Qualifications:
PMP certified project management also a plus
Hands on manufacturing/technical experience is a big plus
Experience with cost modeling, pricing, quoting activities and products would be beneficial
Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures are desired
Experience/knowledge of flip chip packaging failure analysis methods is desired
Familiarity with Design of Experiments and Statistical Process Control (JMP) is a plus
Willing and able to travel 15% domestic and 15% internationally
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
