Design and develop hermetic/ceramic/metal and RAD(radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging.Package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability power applications.Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay).Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD.Work with OSAT(Outsourced Semiconductor Assembly & Test )/Palm Bay to run DOE to optimize processes and establish process spec.Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager.Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages.Participate in packaging roadmap development & focus on execution.
