Job DescriptionWe're actively looking for a talented and seasoned Microelectronics Process Engineer who specializes in wire bonding. If you're passionate about cutting-edge technology, this role is for you! As part of our team, you'll be responsible for driving the development and maintenance of innovative solutions for microelectronic assembly and testing. Your primary focus will be on wire bonding, catering to both RF and Digital applications.Skills and RequirementsWire bonding experienceBachelor's degree in mechanical engineering, Material Science, or a related field.5+ years of experience in process engineering, with a focus on microelectronics assemblyPractical experience with wire bonding for RF, Digital, or Analog/Mixed-signal applicationsStrong communication skills Strong understanding of quality and reliability industry standards for military applications'Knowledge of advanced IC packaging technologies nullWe are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion,sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military oruniformed service member status, or any other status or characteristic protected by applicable laws, regulations, andordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to HR@insightglobal.com.
