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Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems.
We develop Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. This entails design, simulation and test of microwave (MMIC) and RF (RFIC) integrated circuits (ICs), high-performance analog and mixed-signal ICs, complex high performance digital ICs, high performance 3D microelectronics packaging and systems on chip (SOC) and systems in package (SIP) technologies. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conduct research and design microelectronics hardware in support of these projects.
We are seeking experienced Principal Investigators (PIs) to lead the shaping, capture, and execution of SSED's microelectronics research & development (R&D) programs in multiple areas. The successful candidate will accomplish this by leveraging deep knowledge of and a network of connections in: 1) the military/aerospace microelectronics development community; 2) the US government microelectronics R&D community; 3) SSED's customer & partner organizations within Boeing; and 4) the commercial microelectronics industry.
This position has a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week.