As a Product Reliability engineer, you will play a key role in ensuring the reliability and quality of Lumotive’s Light Control Metasurface (LCM) products, controller ASICs and reference designs. Your responsibilities will encompass the entire lifecycle of product qualification: from the design stage through to successful qualification completion. This includes developing and reviewing Design for Reliability and Design for Test protocols to ensure that our products are both stress-able and testable. Your scope will encompass both the metasurface chip itself, the driver/controller ASIC, multi-chip modules and the lidar reference designs into which it is incorporated – qualification both the component and module level. It will be key to provide clear feedback to multiple teams on design weaknesses at each level.   You will assess and perform yield analysis and correlation analysis across all levels of testing, employing statistical methods and Pareto analysis to drive improvements. Additionally, you will guide suppliers in enhancing their processes as needed, ensuring that they meet our high standards for fabrication, packaging, assembly, and ongoing reliability monitoring. You will also be responsible for investigating and resolving qualification fallouts and nonconformance issues related to product and process, utilizing methodologies such as Failure Analysis (FA), Corrective Action Reports (CAR), and 8D reporting supporting Product Change Notifications (PCN) or Engineering Change Notifications (ECN)  Bachelor’s or Master’s degree in electrical engineering, physics, or related fields 5+ years of industry experience Semiconductor engineering experience in reliability and / or failure analysis roles Experience with novel semiconductor technologies and material sets having new failure modes Experience in both ASIC and module product level reliability qualification and lifetime behavior modeling Experience with reliability and quality standards, such as: JEDEC, ISO, AEC Knowledge of common failure modes of silicon and module packaging technologies Prior experience defining hardware setups and equipment for life, environmental, ESD, latch-up, and other tests Experience driving suppliers in silicon CMOS process, packaging, assembly, testing, and ongoing reliability monitoring Auditing experience of supplier sites, materials, and processes Familiarity with process flows, specifications, and supervising supplier performance (process Cpk, yield, qualification report, etc.) Knowledge of first article inspection practices to validate supplier work prior to production Outstanding written and verbal communication skills 
