Responsibilities:Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.Work with Product groups and Reliability team, qualify new packages and processes within required time frame.Resolve all process integration issues by ensuring all window checks are done on critical process steps.Establish production controls and monitors to ensure there is no room for quality incidents.Ensure smooth transition into production & implement ramp up monitor.Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.Participate in packaging roadmap development & focus on execution.Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.Establish & maintain package design rules.
