Manufacturing engineer owner of wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication.Responsible for statistical process control (SPC) of process, chemistries, and tool parameters (film composition & thickness, deposition / removal rates, pressure, temperature, chemical concentration, pH, etc.).Responsible for optimizing process performance (ensure uniform deposition or removal of metal/dielectric materials), maintain process margin.Conduct failure analysis for process/tool deviations that result in defects and affect wafer quality.Participate in the introduction of new processes/materials into manufacturing and take ownership to maintain these under good control and to achieve maturity.Participate in the introduction and qualification of new Wet process equipment for capacity improvement or technology advancement.
