As a Wafer Wet Process Development Engineer, you will be responsible for developing new wet processes and technologies such as electroplating, wet etch, lift-off, cleaning, and CMP. Your role will involve enabling and accelerating HAMR device wet process development and related technology deployment into head products to meet HDD requirements throughout the product lifecycle.Key Responsibilities:Develop new electroplating materials and processes for HAMR device fabrication.Perform wafer plating, wet etch, lift-off, and wafer cleaning process development to meet new product launch requirements and schedules.Define related wet process roadmaps, and develop or evaluate new processing technologies, methodologies, consumables, or advanced tooling to meet new product needs and manufacturability.Collaborate with cross-functional teams, including design, integration, and other development process modules, to incorporate associated wet processes or resolve integration issues.Troubleshoot issues in the development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.Transfer new processes to the manufacturing engineering (ME) team and support them in process implementation and manufacturing ramp-up.
