Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > ASICS EngineeringGeneral Summary: Qualcomm is the world leader in wireless chipsets powering the majority of 4G and 5G devices, the largest fabless semiconductor in the world, and is widely regarded as one of the most employee friendly companies in the high-tech marketplace. Qualcomm central hardware system (CHS) team has a broad array of responsibilities that include developing cutting edge package technology, developing system-level power and signal integrity from transistor to PMIC on a wide range of products used by millions customers.Responsibility
Apply electrical design expertise to develop Power Distribution Network(PDN) solutions, perform simulation, analysis, and debug.
Conduct power integrity analysis for high speed application processor cores and other cores including GPU/Modem
Extract PCB and PKG PDN parameters, such as resistance and inductance, using standard industry tools.
Perform Lab measurements of PDN in frequency and time domains, including voltage waveform and current waveform.
Define bump and ball patterns and decoupling capacitance scheme.
Work with system designers, design verification and physical design teams to define, implement, and verify power delivery solutio
Minimum Qualifications: Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.ORMaster's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.ORPhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.Preferred Qualifications:
MSc in Electrical Engineering with 5 years of experience in related industry
Solid background in package and PCB extraction, analysis flow and SOC floor planning
Familiar with industry tools (SIWave, HSPICE, Matlab)
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