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Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary: Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, and work directly with and support multiple product development teams. Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end and back end processes, and supplier interactions.Responsibilities:
Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
Support development of advanced technologies for RF-SiP applications.
Lead all aspects technology integration in to PAMIDs, perform technical risk assessment, launch mitigation plans and ensure yield and reliability metrics are met and are in line with PAMID release schedules.
Understand substrate and assembly Packaging process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs and Quality metrics. Conduct audits, benchmarking and drive best practice methodologies to proactively prevent quality excursions as the technology ramps.
Team cross-functionally with, Design, Device process development, Packaging, FEA and global NPI teams to support technology readiness for new products
Ideate, Sketch and Participate in value engineering and cost reduction plans along with Qualcomm Packaging and Sourcing teams.
Create, conduct, and analyze Design of Experiments (DOE) for development activities, especially those that relate to filter performance as it impacts module behavior.
Ensure product readiness for ramp. Protect product integrity post ramp.
Qualifications:
Master’s Degree or equivalent in Mechanical / Materials / Chemical / Electrical Engineering.
3+ years of experience desired (5-10 preferred) in electronics packaging or related environments, especially RF module industry. Direct experience with RF-mems, SAW / BAW configurations.
At least 3 years direct experience in process engineering, product integration or quality management at tier 1 foundries, assembly sub-contractors or substrate suppliers.
Solid technical understanding of full range of Semiconductor packaging materials, material interactions, processes, dominant failure mechanisms and analytical techniques.
Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
Familiarity with PCB design and layout tools preferred.
Understanding of package/product qualification and reliability methods and failure analysis is required.
Understanding of statistics, control methodology, FMEA, analytical trouble shooting in a factory environment is required.
Prior management experience of engineering teams preferred.
Excellent communication skills.
Willingness to travel internationally, typically once per quarter.
Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hrpublicarticleview&sysparmarticle=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.Qualcomm is an equal opportunity employer and supports workforce diversity.To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.Pay range: $169,000.00 - $254,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer!If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification
